Detailed Characterisation of Ni Microinsert Technology For Flip Chip Die on Wafer Attachment

Face to face interconnection is an important technology for the assembly of heterogeneously integrated systems, it permits the integration of technologies from disparate backgrounds and allows separate technology optimization prior to assembly. This paper reports work on the optimization of micro-insert technology, which allows the electrical connection between the two systems. Detailed electrical characterization of the technology has been benchmarked against acoustic microscopy and close correlations have been identified using a combination of these techniques. Process constraints identified in the course of this work have been identified and used in the optimization of the technology.