An experimental study of the under-fill effects for WLCSP components

Author

Chen, Y.S. ; Wang, C.S. ; Shiah, A.C.

Author_Institution

Yuan Ze Univ., Taoyuan, Taiwan

fYear

2004

fDate

2004

Firstpage

246

Lastpage

253

Abstract

For the most recent developed BGA components, such as flip chip BGAs and wafer level CSPs (WLCSP), all are required to have reliability tests conducted before being launched into mass production. Among the mechanical stress tests for electronic components, the most commonly seen are vibration tests, bend tests and shock tests. Rarely seen is the shear test for an electronic component with solder balls mounted on the printed circuit boards. This paper discusses the effects of various under-fills on a WLCSP through a series of shear tests and bend tests. The technique is applicable to new package designs, even for those with environmentally compatible materials.

Keywords

bending; chip scale packaging; encapsulation; integrated circuit reliability; integrated circuit testing; shear strength; WLCSP component under-fill effects; bend tests; environmentally compatible materials; flip chip BGA; mechanical stress tests; reliability tests; shear test; solder ball PCB mounting; wafer level CSP; Circuit testing; Electric shock; Electronic components; Electronic equipment testing; Electronics packaging; Flip chip; Mass production; Printed circuits; Stress; Vibrations;

fLanguage

English

Publisher

ieee

Conference_Titel

Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the

Print_ISBN

0-7803-8203-X

Type

conf

DOI

10.1109/AGEC.2004.1290913

Filename

1290913