Title :
A new approach to the study of single bit failure mechanism in semiconductor devices
Author :
Lee, Soon Ju ; Lee, Ju Hee ; Kim, Won ; Kim, Jong Hyeop ; Kim, Hyung Do ; Jang, Hee Chang ; Kim, Hyoung Ryeun ; Kim, Ho Joung
Author_Institution :
R&D Div., Hynix Semicond. Inc., Icheon, South Korea
Abstract :
An investigation of open-contact failures in semiconductor devices is common issue. As we changed the cleaning condition of the contact, open failure happened. This contact has nitride in it and recess profile under it. To solve ambiguous fail mechanism we used various analysis methods. Especially, double XTEM sample image was the key and we confirmed the mechanism by reproducing experiment.
Keywords :
failure analysis; semiconductor device reliability; transmission electron microscopy; double XTEM sample image; open-contact failures; semiconductor devices; single bit failure mechanism; Chemicals; Cleaning; Epitaxial growth; Filling; Nitrogen; Plugs; Silicon;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2011.5992784
