Title :
Dynamic Crack Propagation Prediction of Solder Joints under Impact Conditions
Author :
Towashiraporn, Pongpinit ; Crosbie, Paul ; Brown, Matt ; Cavallaro, Alberto
Author_Institution :
Motorola Inc., Libertyville
fDate :
May 29 2007-June 1 2007
Abstract :
Failure predictive modeling based on cohesive constitutive relation is used to study the effect of solder-joint array geometry on the integrity of live solder joints. The dynamic overstress state and crack propagation of the interface between the solder and the pad results in complete interface separation. This failure mode is predominant under impact conditions and is captured accurately by a numerical model. Package-level drop tests were simulated and experimentally validated by a 4-point dynamic bend system.
Keywords :
crack detection; failure (mechanical); impact (mechanical); solders; dynamic crack propagation; failure predictive modeling; impact conditions; solder-joint array geometry; Aluminum alloys; Assembly; Capacitive sensors; Creep; Integrated circuit interconnections; Materials reliability; Packaging; Soldering; Stress; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373871
