DocumentCode
2878893
Title
Sodium diffusion, selenization, and microstructural effects associated with various molybdenum back contact layers for CIS-based solar cells
Author
Scofield, John H. ; Asher, S. ; Albin, D. ; Tuttle, J. ; Contreras, M. ; Niles, D. ; Reedy, R. ; Tennant, A. ; Noufi, R.
Author_Institution
Dept. of Phys., Oberlin Coll., OH, USA
Volume
1
fYear
1994
fDate
5-9 Dec 1994
Firstpage
164
Abstract
By varying the argon pressure during deposition, the authors have prepared a set of sputtered molybdenum films on soda-lime glass substrates with a range of mechanical and electrical properties. These films were subsequently exposed to several of the processing steps used in the fabrication of copper-indium-diselenide (CIS) solar sells. Processing steps of interest include heating in a vacuum, exposure to selenium vapor at elevated temperatures, and deposition of CIS and CIGS layers over the Mo. Resulting Mo films and structures were subsequently characterized using XPS, SEM, Auger, and SIMS. Here, they describe the results of these experiments and their implications for CIS cell fabrication
Keywords
Auger effect; X-ray photoelectron spectra; copper compounds; electrical contacts; indium compounds; molybdenum; scanning electron microscopy; secondary ion mass spectroscopy; semiconductor device testing; semiconductor growth; semiconductor thin films; solar cells; sputter deposition; sputtered coatings; ternary semiconductors; Auger; CuInSe2; Mo; SEM; SIMS; XPS; back contact layers; diffusion; electrical properties; fabrication; mechanical properties; microstructural effects; selenization; soda-lime glass substrates; solar cells; sputtered semiconductor thin films; Argon; Computational Intelligence Society; Conductivity; Fabrication; Glass; Mechanical factors; Optical films; Photovoltaic cells; Substrates; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Energy Conversion, 1994., Conference Record of the Twenty Fourth. IEEE Photovoltaic Specialists Conference - 1994, 1994 IEEE First World Conference on
Conference_Location
Waikoloa, HI
Print_ISBN
0-7803-1460-3
Type
conf
DOI
10.1109/WCPEC.1994.519833
Filename
519833
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