• DocumentCode
    2878908
  • Title

    Passi4: The next Technology for Passive Integration on Silicon

  • Author

    den Dekker, A. ; van Geelen, A. ; van der Wel, P. ; Koster, R. ; Rodenburg, E.C.

  • Author_Institution
    NXP Semicond., Nijmegen
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    968
  • Lastpage
    973
  • Abstract
    A new technology for passive integration on silicon is presented. Accurate low density capacitors, high density capacitors, coils, resistors and trough wafer interconnect enable the realization of a highly miniaturized front-end module (FEM) for GSM without SMD´s. Partitioning of passives is optimized to achieve minimum size (6times6times1 mm3) and low cost at acceptable performance.
  • Keywords
    capacitors; coils; passive networks; resistors; silicon; GSM; capacitors; coils; front-end module; resistors; silicon passive integration; wafer interconnects; Capacitors; Contacts; Dielectric substrates; GSM; Integrated circuit interconnections; Optimized production technology; Paramagnetic resonance; Radio frequency; Resistors; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
  • Conference_Location
    Reno, NV
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0985-3
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2007.373914
  • Filename
    4250000
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2878908