DocumentCode :
2878927
Title :
Global Universal Radio Units (GURU) Realized Using Multilayer Organics (MLO)
Author :
Dalmia, S. ; White, G. ; Govind, V. ; Carastro, L. ; Min, Sung-Hwan ; Sundaram, V.
Author_Institution :
Jacket Micro Devices, Inc., Atlanta
fYear :
2007
fDate :
May 29 2007-June 1 2007
Firstpage :
979
Lastpage :
985
Abstract :
This paper presents for the first time the design, fabrication, and implementation of a complete multi-band radio unit using SiP/SOP technology that supports dual band WLAN (802.1 1n), WiMAX (802.16e), and Bluetooth technology in a single module. This module, the Global Universal Radio Unit (GURU), serves as a platform for integration of multiple radio bands in the smallest form factor (< 70 mm2). To achieve this level of integration in the smallest form factor high Q factor band pass filters, diplexers, couplers, and a combination thereof were realized on multilayer organic substrates using a proprietary process. Multilayer organics are being targeted as the most cost effective and highest performance alternative to technologies such as low temperature co-fired ceramic (LTCC), multilayer ceramic (MLC) and thin film on silicon (TFOS) which also strive to integrate multiple bands in a single module. The paper presents novel packaging techniques and IC integration techniques on 6-10 layer multilayer substrates with embedded components, to achieve miniaturization. As an example, a complete dual band WLAN module is presented with two transmits and two receives in a size of 4 mm x 8 mm. The module consists of two dual band PA die, two switch die and two LNA die. The multilayer board integrates input output matching circuitry, 2 diplexers, 4 baluns and several biasing circuitry for amplifiers and switches. The current standard size for such a module in the industry is approximately 10 x 14 mm which is four times larger than the module presented here.
Keywords :
Bluetooth; Q-factor; WiMax; band-pass filters; electronics packaging; radio equipment; wireless LAN; Bluetooth technology; IC integration techniques; Q factor band pass filters; SiP/SOP technology; WiMAX; amplifiers; baluns; dual band WLAN; global universal radio units; multiband radio unit; multilayer organic substrates; multilayer organics; packaging techniques; Ceramics; Circuits; Dual band; Fabrication; Impedance matching; Nonhomogeneous media; Substrates; Switches; WiMAX; Wireless LAN; Bluetooth; LCP; LTCC; RF; SOP; SiP; WLAN; WiMAX; embedded passives; front end module; high dielectric constant; lead free solder; low loss tangent; multiband; multilayer organic; polymer; radios; wireless;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
ISSN :
0569-5503
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2007.373916
Filename :
4250002
Link To Document :
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