• DocumentCode
    2879574
  • Title

    Integrating Specification and Programs for System Modeling and Verification

  • Author

    Sun, Jun ; Liu, Yang ; Dong, Jin Song ; Chen, Chunqing

  • Author_Institution
    Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2009
  • fDate
    29-31 July 2009
  • Firstpage
    127
  • Lastpage
    135
  • Abstract
    High level specification languages like CSP use mathematical objects as abstractions to represent systems and processes. System behaviors are described as process expressions combined with compositional operators, which are associated with elegant algebraic laws for system analysis. Nonetheless, modeling systems with non-trivial data and functional aspects using CSP remains difficult. In this work, we propose a modeling language named CSP# (short for communicating sequential programs) which integrates high-level modeling operators with low-level procedural codes, for the purpose of efficient mechanical system verification. We demonstrate that data operations can be modeled as terminating sequential programs, which can be composed using high-level compositional operators. CSP# is supported by the PAT model checker and has been applied to a number of systems.
  • Keywords
    communicating sequential processes; formal specification; program verification; specification languages; systems analysis; algebraic law; communicating sequential program; compositional operator; high level specification language; high-level modeling operator; low-level procedural code; mathematical object; mechanical system verification; process expression; system analysis; system modeling; system verification; Carbon capture and storage; Data structures; Logic; Mechanical systems; Message passing; Modeling; Software engineering; Specification languages; Sun; Testing; Language; Model Checking; Specification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Theoretical Aspects of Software Engineering, 2009. TASE 2009. Third IEEE International Symposium on
  • Conference_Location
    Tianjin
  • Print_ISBN
    978-0-7695-3757-3
  • Type

    conf

  • DOI
    10.1109/TASE.2009.32
  • Filename
    5198495