Title :
Embedding of Optical Interconnections in Flexible Electronics
Author :
Bosman, E. ; Van Steenberge, G. ; Geerinck, P. ; Christiaens, W. ; Vanfleteren, J. ; Van Daele, P.
Author_Institution :
Ghent Univ., Ghent
fDate :
May 29 2007-June 1 2007
Abstract :
This paper describes the development of a flexible substrate or foil in which optical waveguides, light sources, detectors, and electronic circuitry are embedded. The generic technology offers an integrated solution to the increasing demand for flexible optical sensors and creates a technology platform for the establishment of flexible high-speed optical data connections, based on optical wave guiding layers. Patterning of the optical waveguiding is done using both a standard photolithography process and laser ablation. The resulting opto-electrical foil shows very good flexible behavior and low optical propagation and bending losses.
Keywords :
flexible electronics; high-speed optical techniques; laser ablation; light propagation; optical interconnections; optical sensors; optical waveguides; photolithography; bending losses; detectors; electronic circuitry; flexible electronics; flexible optical sensors; high-speed optical data connections; laser ablation; light sources; optical interconnections; optical propagation; optical wave guiding layers; optical waveguides; optical waveguiding; opto-electrical foil; photolithography process; Flexible electronics; Flexible printed circuits; High speed optical techniques; Integrated circuit technology; Integrated optics; Light sources; Lithography; Optical interconnections; Optical sensors; Optical waveguides;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373960