Title :
Pattern Density Methodology Using IBM Foundry Technologies
Author :
Scagnelli, David ; Grant, Casey ; Carrig, Keith ; Kemerer, Tim ; Landis, Howard ; McDevitt, Tom ; Sucharitaves, Jeanne-Tania ; Tsai, Esther ; Kumar, Mukesh ; Pastel, Paul
Author_Institution :
IBM Microelectron., Essex
fDate :
May 29 2007-June 1 2007
Abstract :
An overview of important pattern density requirements and tradeoffs for advanced RF, analog and digital technologies is presented. This paper reviews process sensitivities to pattern density, the advantage of pattern density compliant designs, performance and modeling considerations, and presents methods of detecting and enhancing pattern density deficiencies to improve overall manufacturability.
Keywords :
integrated circuit manufacture; manufacturing processes; IBM foundry technologies; RF technologies; analog technologies; chemical mechanical polishing; digital technologies; manufacturability; pattern density methodology; process sensitivity; Chemical processes; Chemical technology; Condition monitoring; Foundries; Manufacturing processes; Optical microscopy; Optical sensors; Pulp manufacturing; Shape; Virtual manufacturing;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373963
