DocumentCode :
2879841
Title :
Embedded Chip Build-Up in a Wafer-Level Packaging Environment
Author :
Bauer, C.E. ; Neuhaus, H.J.
Author_Institution :
TechLead Corp., Evergreen
fYear :
2007
fDate :
May 29 2007-June 1 2007
Firstpage :
1308
Lastpage :
1312
Abstract :
Embedded chip build-up technology maintains compatibility with both printed circuit panel and wafer-level packaging infrastructures. In this paper the authors present a detailed infrastructure and cost trade off analysis of embedded chip packaging of microprocessors in these two environments. Packaging cost reported consists of the following elements: dielectric, metallization, patterning, via formation, assembly and other cost additions. The analysis identifies two distinct sources of yield loss: defective chips and build-up interconnect fabrication defects. While the losses due to defective chips remain independent of the packaging environment, build-up interconnect yield losses are strongly influenced by the type of equipment employed as well as the feature sizes of the design.
Keywords :
costing; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit yield; microprocessor chips; printed circuits; wafer level packaging; build-up interconnect fabrication defects; cost trade off analysis; defective chips; embedded chip build-up technology; embedded chip packaging; infrastructure analysis; metallization; microprocessors; packaging cost; patterning; printed circuit panel; wafer-level packaging environment; yield loss sources; Assembly; Costs; Dielectrics; Fabrication; Integrated circuit interconnections; Metallization; Microprocessors; Packaging; Printed circuits; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
ISSN :
0569-5503
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2007.373964
Filename :
4250050
Link To Document :
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