Chip Scale Module Package for WLAN Module Application

Design issues for a silicon-based SiP structure are presented in this paper. The package of a WLAN application includes active dies and passive components. Except for some large value capacitors, almost all passive components (RCL, filter, balun, matching) and interconnection are integrated in a silicon substrate. This high level integration scheme is realized using chip scale module package (CSMP) and integrated passive device (IPD) technology. Sophisticated design tools are used to simulate the electromagnetic (EM) response of the CSMP/IPDs and to verify the signal integrity between critical lines.