Title :
Simulation Based Package Impedance Characterization of High Speed Differential Systems
Author :
Mandhana, Om P. ; Zhao, Jin
Author_Institution :
Freescale Semicond., Inc.,, Austin
fDate :
May 29 2007-June 1 2007
Abstract :
The purpose of this paper is to present design oriented modeling, simulation, analysis of coupled differential signals with return path discontinuity in the packages. The variation of insertion loss, and return loss corresponding to differential mode and common mode operation are obtained considering different types of impedance parameters. The methodology and simulation results presented in the paper provide detailed understanding of impedance characterization useful for the design of differential signals routed through high speed packages.
Keywords :
circuit simulation; electric impedance; integrated circuit design; integrated circuit modelling; system-in-package; common mode operation; coupled differential signals analysis; coupled differential signals simulation; design oriented modeling; differential mode operation; differential signals routing design; high speed differential system; impedance characterization; impedance parameter; insertion loss; return loss; return path discontinuity; simulation based package impedance; Analytical models; Computational modeling; Impedance; Insertion loss; Scattering parameters; Semiconductor device noise; Semiconductor device packaging; Signal analysis; Signal design; Transmission line discontinuities;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.374031