Crosstalk Analysis Between Non-Parallel Coupled Lines Connected With Vias in a 4-layer PCB

Author

Han, Jae Kwon ; Park, Dong Chul

Author_Institution

Dept. of Radio Sci. & Eng., Chung Nam Nat. Univ., Taejon

fYear

2006

fDate

1-4 Aug. 2006

Firstpage

728

Lastpage

731

Abstract

Multi-layer PCBs are often used in compact microwave circuit design as density of PCB layout is increased. In this paper, the crosstalk between non-parallel coupled lines connected with vias in a 4-layer PCB is investigated theoretically based on the circuit-concept approach. Non-parallel coupled lines connected with vias in a 4-layer PCB are divided into three sections, which are coupled microstrip lines and upper via section, center via section, and lower via and coupled microstrip lines section, respectively. Each section is represented by ABCD matrix. By cascading these three ABCD matrices crosstalk between non-parallel coupled lines connected with vias in a 4-layer PCB is approximately calculated. The validity of this theoretical approach is verified by comparing the calculated results with the simulated ones using HFSS

Keywords

crosstalk; matrix algebra; microstrip lines; printed circuits; ABCD matrix; coupled microstrip lines; crosstalk analysis; multilayer PCB; nonparallel coupled lines; Coupling circuits; Crosstalk; Electromagnetic fields; Electromagnetic interference; Microstrip; Multiconductor transmission lines; Power transmission lines; Transmission line matrix methods; Transmission line theory; Voltage; 4-layer PCB; ABCD matrices; circuit-concept approach; crosstalk; non-parallel coupled lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Environmental Electromagnetics, The 2006 4th Asia-Pacific Conference on

Conference_Location

Dalian

Print_ISBN

1-4244-0183-6

Type

conf

DOI

10.1109/CEEM.2006.258057

Filename

4027389