Sources of Creep Data Scattering of Solders in Micro-electronic Packaging

Author

Yu, Jin ; Shin, S.W. ; Kim, S.B.

Author_Institution

Korea Adv. Inst. of Sci. & Technol., Daejeon

fYear

2007

fDate

May 29 2007-June 1 2007

Firstpage

1796

Lastpage

1801

Abstract

A large scattering of creep data of Pb-free solders existing in literature was investigated by conducting controlled experiments using Sn-3.5Ag alloy. Tensile specimens with different solidification rate from the melt were prepared to study the effect of solder microstructure, while simple shear (SS) and lap shear (LS) tests were added to find a mechanistic effect of multiaxial loading. Effects of the solder ball geometry was studied using 3D-FEM, and varying amounts of Cu (0.75 and 1.5 wt%) were added to Sn-3.5Ag solder and reflowed over Cu or Ni pad to investigate effects of pad metal dissolution in solder. Results identified the solder microstructure and the loading method as primary factors which could vary the creep deformation rate by 3-4 orders of magnitude. Relatively milder effects were found regarding to variations of solder ball geometry and of solder composition by pad metal dissolution.

Keywords

copper; finite element analysis; integrated circuit packaging; nickel; shear deformation; solders; solidification; tin alloys; 3D-FEM; Cu; Ni; SnAg; creep data scattering; creep deformation; lap shear tests; lead-free solders; microelectronic packaging; multiaxial loading; pad metal dissolution; simple shear tests; solder ball geometry; solder microstructure; solidification; Conducting materials; Creep; Electronics packaging; Finite element methods; Geometry; Materials testing; Microstructure; Scattering; Strain measurement; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th

Conference_Location

Reno, NV

ISSN

0569-5503

Print_ISBN

1-4244-0985-3

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2007.374040

Filename

4250126