• DocumentCode
    2881255
  • Title

    System-Design-for-Reliability Tools for Highly Integrated Electronic Packaging Systems

  • Author

    Kim, Injoong ; Pucha, Raghuram V. ; Peak, Russell S. ; Sitaraman, Suresh K.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    1809
  • Lastpage
    1814
  • Abstract
    A system design-for-reliability (SDfR) is a method for designing subsystems, selecting components, and designing interconnections to achieve targeted system reliability in a given context. This paper presents SDfR Tools based on reliability object model (ROM) that provides a framework for system-design-for-reliability of next generation highly integrated electronic systems. The SDfR tools developed based on ROM include generic domain tools that allocate target reliability, assess system reliability, modify system reliability, and manage different level or disciplinary subsystem design for reliability. They also include specific domain tools that helps for subsystem designers to predict component reliability based on specific-domain reliability knowledge, assess subsystem reliability, and modify component design. The component level specific domain tools integrate statistical-based field data, accelerated testing date and physics-based life prediction models of components and subsystems. The field data is implemented in OracleTM, the life prediction models are implemented as MATLABTM and ANSYSTM script files. The developed SDfR tool is demonstrated thorough case studies in electronic systems.
  • Keywords
    circuit reliability; electronic design automation; electronics packaging; ANSYS; MATLAB; Oracle; integrated electronic packaging systems; reliability object model; specific-domain reliability knowledge; system-design-for-reliability tools; Assembly systems; Design methodology; Electronics packaging; Failure analysis; Life estimation; Mathematical model; Predictive models; Read only memory; Reliability; US Department of Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
  • Conference_Location
    Reno, NV
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0985-3
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2007.374042
  • Filename
    4250128