Title :
System-Design-for-Reliability Tools for Highly Integrated Electronic Packaging Systems
Author :
Kim, Injoong ; Pucha, Raghuram V. ; Peak, Russell S. ; Sitaraman, Suresh K.
Author_Institution :
Georgia Inst. of Technol., Atlanta
fDate :
May 29 2007-June 1 2007
Abstract :
A system design-for-reliability (SDfR) is a method for designing subsystems, selecting components, and designing interconnections to achieve targeted system reliability in a given context. This paper presents SDfR Tools based on reliability object model (ROM) that provides a framework for system-design-for-reliability of next generation highly integrated electronic systems. The SDfR tools developed based on ROM include generic domain tools that allocate target reliability, assess system reliability, modify system reliability, and manage different level or disciplinary subsystem design for reliability. They also include specific domain tools that helps for subsystem designers to predict component reliability based on specific-domain reliability knowledge, assess subsystem reliability, and modify component design. The component level specific domain tools integrate statistical-based field data, accelerated testing date and physics-based life prediction models of components and subsystems. The field data is implemented in OracleTM, the life prediction models are implemented as MATLABTM and ANSYSTM script files. The developed SDfR tool is demonstrated thorough case studies in electronic systems.
Keywords :
circuit reliability; electronic design automation; electronics packaging; ANSYS; MATLAB; Oracle; integrated electronic packaging systems; reliability object model; specific-domain reliability knowledge; system-design-for-reliability tools; Assembly systems; Design methodology; Electronics packaging; Failure analysis; Life estimation; Mathematical model; Predictive models; Read only memory; Reliability; US Department of Transportation;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.374042