DocumentCode
2881255
Title
System-Design-for-Reliability Tools for Highly Integrated Electronic Packaging Systems
Author
Kim, Injoong ; Pucha, Raghuram V. ; Peak, Russell S. ; Sitaraman, Suresh K.
Author_Institution
Georgia Inst. of Technol., Atlanta
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
1809
Lastpage
1814
Abstract
A system design-for-reliability (SDfR) is a method for designing subsystems, selecting components, and designing interconnections to achieve targeted system reliability in a given context. This paper presents SDfR Tools based on reliability object model (ROM) that provides a framework for system-design-for-reliability of next generation highly integrated electronic systems. The SDfR tools developed based on ROM include generic domain tools that allocate target reliability, assess system reliability, modify system reliability, and manage different level or disciplinary subsystem design for reliability. They also include specific domain tools that helps for subsystem designers to predict component reliability based on specific-domain reliability knowledge, assess subsystem reliability, and modify component design. The component level specific domain tools integrate statistical-based field data, accelerated testing date and physics-based life prediction models of components and subsystems. The field data is implemented in OracleTM, the life prediction models are implemented as MATLABTM and ANSYSTM script files. The developed SDfR tool is demonstrated thorough case studies in electronic systems.
Keywords
circuit reliability; electronic design automation; electronics packaging; ANSYS; MATLAB; Oracle; integrated electronic packaging systems; reliability object model; specific-domain reliability knowledge; system-design-for-reliability tools; Assembly systems; Design methodology; Electronics packaging; Failure analysis; Life estimation; Mathematical model; Predictive models; Read only memory; Reliability; US Department of Transportation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.374042
Filename
4250128
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