DocumentCode :
2881349
Title :
Mechanical Degradation, Thermal-and Electromigration in Large Volume Solder Joints
Author :
Meier, Karsten ; Roellig, Mike ; Wiese, Steffen ; Goette, Carsten ; Deml, Ulrich ; Wolter, Klaus-juergen
Author_Institution :
Dresden Univ. of Technol., Dresden
fYear :
2007
fDate :
May 29 2007-June 1 2007
Firstpage :
1839
Lastpage :
1845
Abstract :
The objective of the paper is to present the results of electromigration, thermomigration and mechanical degradation experiments on large volume solder joints of power electronic components (TO packages). Two solder alloys -SnAgCu and SnPb -were tested for mechanical degradation, thermo-and electromigration behaviour. A test setup for experiments on electromigration will be described that allows testing at very high absolute currents (up to I= 100 A) which are necessary for electromigration testing of these large volume solder joints. The numerous difficulties of transmitting such high currents to the solder joints of the relevant TO-components will be discussed. Thermographic analysis of the test structures will be presented that show accurate adjustment of test temperatures at the solder joints of the TO-components.
Keywords :
copper alloys; electromigration; flip-chip devices; infrared imaging; lead alloys; mechanical properties; power electronics; silver alloys; solders; thermal analysis; tin alloys; SnAgCu; SnPb; electromigration; flip chip components; large volume solder joints; mechanical degradation; metallographic analysis; power electronic components; test structures; thermographic analysis; thermomigration; Current density; Electromigration; Electronic packaging thermal management; Flip chip; Intermetallic; Microstructure; Power electronics; Soldering; Testing; Thermal degradation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
ISSN :
0569-5503
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2007.374047
Filename :
4250133
Link To Document :
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