DocumentCode :
2881410
Title :
Linking Geometrical and Electrical Parameters of Flex Substrate Vertical Interconnects for 2.5D System-in-Package Design
Author :
Maass, Uwe ; Polityko, David Dmitry ; Richter, Christian ; Ndip, Ivan ; Hefer, Jan ; Guttowski, Stephan ; Reichl, Herbert
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin
fYear :
2007
fDate :
May 29 2007-June 1 2007
Firstpage :
1861
Lastpage :
1865
Abstract :
Flexible substrate are gaining more and more in importance in different electronics area. One of the methods to achieve vertical integration within system-in-package (SiP) approach is folding of substrates. The behavior of the folded segments, which are acting as vertical interconnects will be discussed in this paper from geometrical and electrical point of view.
Keywords :
geometry; integrated circuit design; integrated circuit interconnections; system-in-package; 2.5D system-in-package design; electrical parameter; flex substrate vertical interconnects; geometrical parameter; Bonding; Electric variables; Geometry; Joining processes; Millimeter wave measurements; Packaging; Solid modeling; Stacking; Substrates; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
ISSN :
0569-5503
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2007.374051
Filename :
4250137
Link To Document :
بازگشت