Title :
Linking Geometrical and Electrical Parameters of Flex Substrate Vertical Interconnects for 2.5D System-in-Package Design
Author :
Maass, Uwe ; Polityko, David Dmitry ; Richter, Christian ; Ndip, Ivan ; Hefer, Jan ; Guttowski, Stephan ; Reichl, Herbert
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin
fDate :
May 29 2007-June 1 2007
Abstract :
Flexible substrate are gaining more and more in importance in different electronics area. One of the methods to achieve vertical integration within system-in-package (SiP) approach is folding of substrates. The behavior of the folded segments, which are acting as vertical interconnects will be discussed in this paper from geometrical and electrical point of view.
Keywords :
geometry; integrated circuit design; integrated circuit interconnections; system-in-package; 2.5D system-in-package design; electrical parameter; flex substrate vertical interconnects; geometrical parameter; Bonding; Electric variables; Geometry; Joining processes; Millimeter wave measurements; Packaging; Solid modeling; Stacking; Substrates; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.374051