Title :
Laser cleaving method using thermal induced stress for FPD’s and wafer materials
Author :
Haupt, Oliver ; Stute, Uwe
Author_Institution :
Laser Zentrum Hannover e.V., Hannover
Abstract :
Cleaving of brittle materials is a non-ablating high potential process based on thermal-induced-stress. Amorphous materials such as glass can be separated as well as crystalline structures using near-infrared laser radiation and multiple absorption technology.
Keywords :
brittleness; flat panel displays; laser materials processing; optical glass; thermal stresses; FPD; amorphous materials; brittle materials; crystalline structures; laser cleaving method; multiple absorption technology; near-infrared laser radiation; thermal induced stress; wafer materials; Absorption; Crystalline materials; Glass; Laser ablation; Laser beam cutting; Optical materials; Power generation; Power lasers; Silicon; Thermal stresses; (140.3390) Laser material processing; (160.2750) Glass and other amorphous materials;
Conference_Titel :
Lasers and Electro-Optics, 2006 and 2006 Quantum Electronics and Laser Science Conference. CLEO/QELS 2006. Conference on
Conference_Location :
Long Beach, CA
Print_ISBN :
978-1-55752-813-1
Electronic_ISBN :
978-1-55752-813-1
DOI :
10.1109/CLEO.2006.4628855
