A Large Area and 2 Dimensional Optical Interconnection Platform

The paper suggests a new architecture for 2-dimensional (2-D) chip-to-chip optical interconnection system. To demonstrate a high-capacity and 2-D optical interconnection based on an optical printed circuit board, we designed and fabricated an optical platform which is composed of the 2-D optical transmitter/receiver modules, a 2 layered fiber-and connector-embedded printed circuit board, as a large area advanced board, and compact 90deg-bent fiber blocks with 2 times 6 fiber channels. After the assembly of the optical platform, we measured the approximate -5.3 dB total link loss between the transmitter and the receiver. An optical link at a 3-Gb/s/ch data rate was successfully demonstrated.