DocumentCode
2881677
Title
Transmission Line Characteristics of a CNT-based Vertical Interconnect Scheme
Author
Tan, Chee Wee ; Miao, Jianmin
Author_Institution
Nanyang Technol. Univ., Singapore
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
1936
Lastpage
1941
Abstract
The transmission line behavior of a proposed CNT-based coaxial vertical interconnect scheme is studied while a nanotransmission line model for the CNT interconnect scheme is also proposed. Using copper as a benchmark, a transmission line performance evaluation is carried out, which considers the size and skin effects on its electrical resistivity. As a feature of 1D systems, the total inductance of the proposed CNT coaxial via is dominated by its kinetic inductance while the total capacitance is determined by its lower electrostatic capacitance value. For the frequency response, the CNT via scheme does not perform as well as its copper counterpart. However, the SWCNT via scheme can rival the copper one in the S21 parameter. An exciting range of applications awaits CNTs if new technological advancements can be harvested to reduce their resistance and inductance.
Keywords
carbon nanotubes; integrated circuit interconnections; skin effect; transmission lines; 1D systems; CNT coaxial via; CNT-based coaxial vertical interconnect scheme; electrical resistivity; electrostatic capacitance value; frequency response; kinetic inductance; nanotransmission line model; skin effect; transmission line characteristics; transmission line performance evaluation; Capacitance; Coaxial components; Copper; Electric resistance; Electrostatics; Frequency response; Inductance; Kinetic theory; Skin effect; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.374065
Filename
4250151
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