• DocumentCode
    2881677
  • Title

    Transmission Line Characteristics of a CNT-based Vertical Interconnect Scheme

  • Author

    Tan, Chee Wee ; Miao, Jianmin

  • Author_Institution
    Nanyang Technol. Univ., Singapore
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    1936
  • Lastpage
    1941
  • Abstract
    The transmission line behavior of a proposed CNT-based coaxial vertical interconnect scheme is studied while a nanotransmission line model for the CNT interconnect scheme is also proposed. Using copper as a benchmark, a transmission line performance evaluation is carried out, which considers the size and skin effects on its electrical resistivity. As a feature of 1D systems, the total inductance of the proposed CNT coaxial via is dominated by its kinetic inductance while the total capacitance is determined by its lower electrostatic capacitance value. For the frequency response, the CNT via scheme does not perform as well as its copper counterpart. However, the SWCNT via scheme can rival the copper one in the S21 parameter. An exciting range of applications awaits CNTs if new technological advancements can be harvested to reduce their resistance and inductance.
  • Keywords
    carbon nanotubes; integrated circuit interconnections; skin effect; transmission lines; 1D systems; CNT coaxial via; CNT-based coaxial vertical interconnect scheme; electrical resistivity; electrostatic capacitance value; frequency response; kinetic inductance; nanotransmission line model; skin effect; transmission line characteristics; transmission line performance evaluation; Capacitance; Coaxial components; Copper; Electric resistance; Electrostatics; Frequency response; Inductance; Kinetic theory; Skin effect; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
  • Conference_Location
    Reno, NV
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0985-3
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2007.374065
  • Filename
    4250151