Abstract :
In view of the rapid advancement in electronic materials and packaging the EMAP2000 has a wide scope in its topics, including wafer level packaging, flip chips, chip scale packages, direct chip attach, multichip module; lead-free solders, adhesives/underfill and encapsulants, wire bonding, fine pitch microvias, build-up technologies; material characterisation, testing and measurements; package design, modelling and simulation; reliability and failure analysis, delaminations and moisture effects; MEMS packaging; thin films/coatings and metallisation
Keywords :
adhesives; delamination; encapsulation; fine-pitch technology; flip-chip devices; lead bonding; metallisation; micromechanical devices; multichip modules; packaging; reliability; soldering; MEMS packaging; adhesives; build-up technologies; chip scale packages; delaminations; direct chip attach; electronic materials; encapsulants; fine pitch microvias; flip chips; lead-free solders; material characterisation; metallisation; moisture effects; multichip module; package design; packaging; reliability; underfill; wafer level packaging; wire bonding;
