DocumentCode
2882212
Title
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)
fYear
2000
fDate
Nov. 30 2000-Dec. 2 2000
Abstract
In view of the rapid advancement in electronic materials and packaging the EMAP2000 has a wide scope in its topics, including wafer level packaging, flip chips, chip scale packages, direct chip attach, multichip module; lead-free solders, adhesives/underfill and encapsulants, wire bonding, fine pitch microvias, build-up technologies; material characterisation, testing and measurements; package design, modelling and simulation; reliability and failure analysis, delaminations and moisture effects; MEMS packaging; thin films/coatings and metallisation
Keywords
adhesives; delamination; encapsulation; fine-pitch technology; flip-chip devices; lead bonding; metallisation; micromechanical devices; multichip modules; packaging; reliability; soldering; MEMS packaging; adhesives; build-up technologies; chip scale packages; delaminations; direct chip attach; electronic materials; encapsulants; fine pitch microvias; flip chips; lead-free solders; material characterisation; metallisation; moisture effects; multichip module; package design; packaging; reliability; underfill; wafer level packaging; wire bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on
Conference_Location
Hong Kong, China
Print_ISBN
0-7803-6654-9
Type
conf
DOI
10.1109/EMAP.2000.904125
Filename
904125
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