DocumentCode :
2882749
Title :
Optimization of black oxide coating thickness as adhesion promoter for copper substrate
Author :
Lebbai, Mohamed ; Szeto, W.K. ; Kim, Jang-Kyo
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear :
2000
fDate :
2000
Firstpage :
206
Lastpage :
213
Abstract :
Black oxide is a conversion coating applied to a copper surface to improve the interface adhesion with polymeric adhesives and moulding compounds. State-of-the-art analytical instruments, including SEM, TEM, XPS, AFM, XRD, goniometry, dynamic SIMS and RBS were employed to characterize the coated surface and interfaces with glob top resins. It was found that the copper oxide layer consists of cupric and cuprous oxides with a continuous change of oxide composition from the top surface to the inside without a distinct boundary in between. Crystallinity of the oxides was barely detected directly from the black oxide coated copper. The cupric oxide exists in the form of a long, fibril structure on nanoscopic scale. The interface bond strength between the copper oxide and glob-top resin increased rapidly in the low range of oxide thickness and became almost constant with further increase in oxide thickness. A functionally similar dependence of oxide thickness and interface adhesion on treatment time was also revealed. Fracture occurred mainly within the oxide layer for black oxide coated substrates (i.e. cohesive failure of black oxide), while fracture tended to occur along the coating-resin interface (i.e. adhesive failure) once the coated surface is debleeded by sandblasting
Keywords :
Rutherford backscattering; X-ray diffraction; X-ray photoelectron spectra; adhesion; adhesives; atomic force microscopy; copper; encapsulation; failure analysis; fracture; goniometers; integrated circuit packaging; interface structure; moulding; optimisation; oxidation; printed circuit manufacture; scanning electron microscopy; secondary ion mass spectra; transmission electron microscopy; AFM; Cu; Cu2O; CuO; RBS; SEM; TEM; XPS; XRD; adhesion promoter; adhesive failure; analytical instruments; black oxide coated copper; black oxide coating thickness; black oxide cohesive failure; black oxide conversion coating; coated surface; coated surface debleeding; coating-resin interface fracture; continuous oxide composition change; copper oxide; copper oxide layer; copper substrate; copper surface; cupric oxides; cuprous oxides; dynamic SIMS; fibril structure; glob top resin interfaces; glob-top resin; goniometry; interface adhesion; interface bond strength; moulding compounds; optimization; oxide crystallinity; oxide layer fracture; oxide thickness; polymeric adhesives; sandblasting; treatment time; Adhesives; Coatings; Copper; Crystallization; Goniometers; Instruments; Nanostructures; Polymer films; Resins; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6654-9
Type :
conf
DOI :
10.1109/EMAP.2000.904156
Filename :
904156
Link To Document :
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