• DocumentCode
    2882843
  • Title

    Circuit and System Design for a Homodyne W-CDMA Front-End Receiver RF IC

  • Author

    Lie, D.Y.C. ; Kennedy, J. ; Livezey, D. ; Yang, B. ; Robinson, T. ; Sornin, N. ; Saint, C. ; Larson, L.E.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., La Jolla, CA
  • fYear
    2006
  • fDate
    26-28 April 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper discusses the RF circuit and system design considerations for W-CDMA homodyne receiver on NF, IIP2, IIP3, LO/TX leakage, I-Q mismatch, DC offsets, etc. A zero-IF receiver front-end SiGe BiCMOS IC is designed, packaged and thoroughly characterized by a set of system-level performance tests across the full frequency band of operation. The measured worst-case cascaded NF for the receiver IC across all channels is 4.3 dB at the max. gain mode, and the in-band/out-of-band IIP2 and IIP3 are +37/+93 and -16.5/+5 dBm, respectively. The I/Q channels exhibit a small mismatch in magnitude (<0.1dB) and in phase (<1deg) without calibration. The receiver RF front-end (i.e., LNA+VGA+ I/Q mixers) draws ~45mW. The system tests results on BER, P1dB, IM2, IM3, and desensing show that the RFIC meets all of the necessary parameters of W-CDMA receiver system specs at room temperature with margin, validating the RF IC block-level circuit design and providing valuable RF-SoC design insights
  • Keywords
    3G mobile communication; BiCMOS integrated circuits; Ge-Si alloys; code division multiple access; integrated circuit design; radio receivers; radiofrequency integrated circuits; BiCMOS integrated circuit; I/Q channels; RF-SoC; SiGe; W-CDMA homodyne receiver; circuit design; code division multiple access; radiofrequency integrated circuit; system design; BiCMOS integrated circuits; Circuit testing; Circuits and systems; Integrated circuit testing; Multiaccess communication; Noise measurement; Radio frequency; Radiofrequency integrated circuits; Silicon germanium; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test, 2006 International Symposium on
  • Conference_Location
    Hsinchu
  • Print_ISBN
    1-4244-0179-8
  • Electronic_ISBN
    1-4244-0180-1
  • Type

    conf

  • DOI
    10.1109/VDAT.2006.258114
  • Filename
    4027486