Title :
Interface failure criterion of button shear test as a means of interface adhesion measurement in plastic packages
Author :
Szeto, W.K. ; Xie, M.Y. ; Kim, J.K. ; Yuen, M.M.F. ; Tong, P. ; Yi, S.
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ., China
Abstract :
The button shear test is widely used to measure the interfacial bond strength between the molding compound and leadframe. In this study, the normal and shear stress fields along the interface for a button shear test specimen with axi-symmetric cylindrical shape are analyzed using the finite element method (FEM). There are stress singularities at the loaded edge for both the interface normal and shear stress components. The shear stress component varies little over the whole bond length, except for the free edge surface, whereas the normal stress component decreases consistently over the bond length from positive to negative values. Therefore, while the average normal stress increases as the loading position moves upward, the average shear stress remains almost constant, independent of loading position. The failure loads obtained for different loading positions in experiments are incorporated into the numerical results to derive the interface failure criterion based on the average stress concept. The interface shear strength was much higher than the interface normal strength, especially for bare copper, which showed 2.5 times difference in these interface strength values. This indicates that the leadframe surface roughness played a significant role in contributing to the interface bond strength. This is consistent with the predominant role of the normal stress component for interface debonding in the button shear test
Keywords :
adhesion; failure analysis; finite element analysis; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; interface structure; internal stresses; materials testing; moulding; plastic packaging; shear strength; stress analysis; surface topography; Cu; FEM; average normal stress; average shear stress; average stress concept; axi-symmetric cylindrical shape; bare copper; bond length; button shear test; button shear test specimen; failure loads; finite element method; free edge surface; interface adhesion measurement; interface bond strength; interface debonding; interface failure criterion; interface normal strength; interface normal stress component; interface shear strength; interface shear stress component; interface strength; interface stress fields; interfacial bond strength; leadframe; leadframe surface roughness; loaded edge stress singularities; loading position; molding compound; normal stress component; normal stress field; plastic packages; shear stress component; shear stress field; Adhesives; Bonding; Copper; Electromagnetic compatibility; Geometry; Packaging; Plastics; Programmable logic arrays; Tensile stress; Testing;
Conference_Titel :
Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6654-9
DOI :
10.1109/EMAP.2000.904165