Title :
A wafer with electrically programmable interconnections
Author_Institution :
Mosaic Systems, Inc., Troy, MI, USA
Abstract :
Wafer-scale ring oscillators interconnected on a 100mm silicon substrate using discretionary electrical programming of two metalization levels with amorphous silicon alloy ´anti-fuses´ will be reported.
Keywords :
Active circuits; Amorphous silicon; Assembly systems; Fuses; Integrated circuit interconnections; Power distribution; Power system interconnection; Ring oscillators; System testing; Transmission line matrix methods;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1985 IEEE International
Conference_Location :
New York, NY, USA
DOI :
10.1109/ISSCC.1985.1156864
