DocumentCode
2883781
Title
40 GHz HEMT MMIC with solder bump mounted horizontal access p-i-n photodetector
Author
Long, A.P. ; Glick, M.
Author_Institution
Marconi Mater. Technol. Ltd., Towcester, UK
fYear
1999
fDate
1999
Firstpage
42370
Lastpage
42375
Abstract
A HEMT MMIC has been designed in conjunction with a model for a high speed 40GHz p-i-n photodiode to achieve minimum transimpedance ripple across the frequency band 4 to 40GHz. RF measurements of the MMIC over the frequency range 1 to 40GHz achieve a typical gain of just over 8dB. p-i-n diodes have been solder bump bonded to the MMIC. The measured optical response at a wavelength of 1.5 μm is essentially flat to 20GHz (limit of current measurement apparatus). Further work is currently underway to measure the frequency response to 40GHz
Keywords
HEMT integrated circuits; 1.5 micrometre; 4 to 40 GHz; 8 dB; HEMT MMIC; RF measurements; frequency response; horizontal access p-i-n photodetector; optical response; solder bump mount; transimpedance ripple;
fLanguage
English
Publisher
iet
Conference_Titel
Opto-Electronic Interfacing at Microwave Frequencies (Ref. No. 1999/045), IEE Colloquium on
Conference_Location
London
Type
conf
DOI
10.1049/ic:19990228
Filename
771937
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