Title :
High speed optoelectronic packaging techniques
Author :
Firth, P. ; Fraser, J. ; Ayliffe, P. ; Kimber, E.M.
Author_Institution :
Nortel Networks plc, Paignton, UK
Abstract :
We have shown that with careful design, utilising short wire bonds and controlled impedance tracks, a type of low cost ceramic packaging for high bit rate opto-electronic systems is suitable for use up to 5 Gb/s. A design for a 10 Gb/s transmitter will require a package with more bandwidth and electro-optic components with smaller residual RC components
Keywords :
ceramic packaging; 5 Gbit/s; ceramic packaging; high speed optoelectronic system; impedance track; transmitter; wire bond;
Conference_Titel :
Opto-Electronic Interfacing at Microwave Frequencies (Ref. No. 1999/045), IEE Colloquium on
Conference_Location :
London
DOI :
10.1049/ic:19990236
