Modeling of Hi-Q Embedded Inductors for RF-SOP Applications

A new broadband nine-element single-stage model is developed for the high-Q spiral inductor buried into the organic laminate package substrate. The technique utilizes only one RLC resonator incorporated in modified T equivalent circuit to accurate characterize high-frequency effects such as skin, proximate, and fringing effects, and that led to the model more compact. Parameter extraction of model is used analytical all-mathematical formulations to evaluate frequency-independent elements. This enables the modeling procedure effectively integrated in SPICE-compatible simulators feasible and facile for efficient design of RFIC modules. The proposed model has been verified using embedded inductor in a 4-layer BT laminate, one of today´s most popular package substrate. Good agreement between measurements and modeling results over the whole interesting frequency regime has been shown to demonstrate the validity of proposed method