DocumentCode :
2884150
Title :
Study of the RHIC BPM SMA connector failure problem
Author :
Liaw, C.J. ; Sikora, R. ; Schroeder, R.
Author_Institution :
BNL, Upton
fYear :
2007
fDate :
25-29 June 2007
Firstpage :
649
Lastpage :
651
Abstract :
About 730 BPMs are mounted on the RHIC CQS and triplet super-conducting magnets. Semi-rigid coaxial cables are used to bring the electrical signal from the BPM feedthroughs to the outside flanges, at the ambient temperature. Every year around 10 cables will lose their signals during the operation. The connection usually failed at the warm end of the cable. The problems were either the solder joint failed or the center conductor retracted out of the SMA connector. Finite element analyses were performed to understand the failure mechanism of the solder joint. The results showed that (1) The SMA center conductor can separate from the mating connector due to the thermal retraction. (2) The maximum thermal stress at the warm end solder joint can exceed the material strength of the Pb37/Sn63 solder material and (3) The magnet ramping frequency (~10 Hz), during the machine startup, can possibly resonant the coaxial cable and damage the solder joints, especially when a fracture is initiated. Test results confirmed that by using the silver bearing solder material (a higher strength material) and by crimping the cable at the locations close to the SMA connector (to prevent the center conductor from retracting) can effectively resolve the connector failure problem.
Keywords :
accelerator magnets; beam handling techniques; coaxial cables; failure (mechanical); finite element analysis; ion accelerators; solders; storage rings; synchrotrons; thermal stresses; RHIC BPM SMA connector failure problem; RHIC CQS; SMA center conductor; beam intensity; electrical signal; finite element analysis; magnet ramping frequency; material strength; semirigid coaxial cables; silver bearing solder material; solder joint; thermal retraction; thermal stress; triplet super-conducting magnets; Coaxial cables; Conducting materials; Connectors; Failure analysis; Joining materials; Magnetic materials; Magnets; Soldering; Thermal conductivity; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Particle Accelerator Conference, 2007. PAC. IEEE
Conference_Location :
Albuquerque, NM
Print_ISBN :
978-1-4244-0916-7
Type :
conf
DOI :
10.1109/PAC.2007.4440308
Filename :
4440308
Link To Document :
بازگشت