DocumentCode :
2884255
Title :
MOSFET devices with polysilicon on single-layer HfO/sub 2/ high-K dielectrics
Author :
Kang, L. ; Onishi, K. ; Jeon, Y. ; Byoung Hun Lee ; Kang, C. ; Wen-Jie Qi ; Nieh, R. ; Gopalan, S. ; Choi, R. ; Lee, J.C.
Author_Institution :
Microelectron. Res. Center, Texas Univ., Austin, TX, USA
fYear :
2000
fDate :
10-13 Dec. 2000
Firstpage :
35
Lastpage :
38
Abstract :
MOSFETs and MOSCAPs of a single-layer thin HfO/sub 2/ gate dielectric with dual polysilicon gate were fabricated with self-aligned process and characterized. Polysilicon and dopant activation processes were optimized such that leakage current and equivalent oxide thickness (EOT) of HfO/sub 2/ remain low (EOT of 12.0 /spl Aring/. HfO/sub 2/ with 1/spl times/10/sup -3/ A/cm/sup 2/ at Vg=1.0 V). Reasonable N- and P-MOSFET characteristics such as subthreshold swing of 74 mV/decade and output currents were also demonstrated.
Keywords :
MOS capacitors; MOSFET; dielectric thin films; hafnium compounds; HfO/sub 2/-Si; MOSCAP; MOSFET; dopant activation; dual polysilicon gate; equivalent oxide thickness; leakage current; output current; self-aligned processing; single-layer HfO/sub 2/ high-K dielectric thin film; subthreshold swing; Annealing; Crystallization; Electrodes; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Leakage current; MOSFET circuits; Semiconductor films; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2000. IEDM '00. Technical Digest. International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-6438-4
Type :
conf
DOI :
10.1109/IEDM.2000.904253
Filename :
904253
Link To Document :
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