DocumentCode :
2884328
Title :
45-nm gate length CMOS technology and beyond using steep halo
Author :
Wakabayashi, H. ; Ueki, M. ; Narihiro, M. ; Fukai, T. ; Ikezawa, N. ; Matsuda, T. ; Yoshida, K. ; Takeuchi, K. ; Ochiai, Y. ; Mogami, T. ; Kunio, T.
Author_Institution :
ULSI Device Dev. Div., NEC Corp., Sagamihara, Japan
fYear :
2000
fDate :
10-13 Dec. 2000
Firstpage :
49
Lastpage :
52
Abstract :
45-nm CMOS devices with a steep halo using a high-ramp-rate spike annealing (HRR-SA) are demonstrated with drive currents of 697 and 292 /spl mu/A//spl mu/m for an off current less than 10 nA//spl mu/m at 1.2 V. For an off current less than 300 nA//spl mu/m, 33-nm pMOSFETs have a high drive current of 403 /spl mu/A//spl mu/m at 1.2 V. In order to fabricate a steeper halo than these MOSFETs, a source/drain extension (SDE) activation using the HRR-SA process was performed after a deep source/drain (S/D) formation. By using this sequence defined as a reverse-order S/D formation, 24-nm nMOSFETs are achieved with a high drive current of 796 /spl mu/A//spl mu/m for an off current less than 300 nA//spl mu/m at 1.2 V.
Keywords :
CMOS integrated circuits; MOSFET; annealing; ion implantation; large scale integration; 1.2 V; 24 to 45 nm; CMOS technology; drive current; drive currents; gate length; high-ramp-rate spike annealing; off current; pMOSFETs; reverse-order S/D formation; source/drain extension activation; steep halo; Annealing; CMOS process; CMOS technology; Dielectric films; Electrodes; Laboratories; Lithography; MOSFETs; Random access memory; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2000. IEDM '00. Technical Digest. International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-6438-4
Type :
conf
DOI :
10.1109/IEDM.2000.904256
Filename :
904256
Link To Document :
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