DocumentCode
2884756
Title
Integrated power switches for X-Band PA
Author
Pereira, Aaron ; Parker, Tony ; Heimlich, Michael ; Weste, Neil
Author_Institution
Dept. of Eng., Macquarie Univ., Sydney, NSW, Australia
fYear
2015
fDate
10-15 May 2015
Firstpage
1617
Lastpage
1622
Abstract
This paper reports on the development of high frequency, high efficiency integrated supply modulators for airborne and space based high power amplifier modules. The power switches within the integrated modulators were RF HEMTs optimized for power amplifier applications. The modulators were fabricated in commercial foundry GaN process and delivered 10W of output power with an efficiency of 83.5% while switching at a frequency of 100 MHz. Development of high frequency supply modulators paves the way for integration of the HPA and modulators onto the MMIC die and on-chip drain bias modulation for efficiency enhancement of the HPA.
Keywords
III-V semiconductors; MMIC power amplifiers; gallium compounds; microwave field effect transistors; microwave switches; power HEMT; wide band gap semiconductors; GaN; MMIC die; RF HEMT; X-band PA; commercial foundry GaN process; efficiency enhancement; frequency 100 MHz; high efficiency integrated supply modulators; high frequency; integrated power switches; on-chip drain bias modulation; power 10 W; power amplifier applications; Gallium nitride; HEMTs; Logic gates; MMICs; MODFETs; Modulation; Switches; MMIC Power Switches; integrated power switches; power converters; supply Modulators;
fLanguage
English
Publisher
ieee
Conference_Titel
Radar Conference (RadarCon), 2015 IEEE
Conference_Location
Arlington, VA
Print_ISBN
978-1-4799-8231-8
Type
conf
DOI
10.1109/RADAR.2015.7131257
Filename
7131257
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