High density, low parasitic direct integration by fluidic self assembly (FSA)

Fluidic self assembly is a novel technique for accurately assembling large numbers of very small devices. The resulting assemblies are planar, and planarization and metallization of the assemblies result in demonstrated interconnect densities of greater than 50 interconnects per millimeter of perimeter, or a density of 10/sup 5/ per cm/sup 2/ with multilevel metallization. This high density is possible due to the planar structure, and an alignment precision of /spl plusmn/1 micron. The small size of the interconnects also results in very low parasitic capacitance, comparable to on die traces. Demonstrated yields are 0.9999 for assemblies with thousands of elements. This paper will discuss this recent progress in self assembly technology, and applications including integration of high capacity optoelectronic I/O devices.