DocumentCode
2885796
Title
Ultra shallow junction profiling
Author
Vandervorst, W. ; Clarysse, T. ; Duhayon, N. ; Eyben, P. ; Hantschel, T. ; Xu, M. ; Janssens, T. ; de Witte, H. ; Conard, T. ; Deleu, J. ; Badenes, G.
Author_Institution
Imec, Heverlee, Belgium
fYear
2000
fDate
10-13 Dec. 2000
Firstpage
429
Lastpage
432
Abstract
Highly precise (few %) and spatially (depth and laterally) resolved (nm) measurements of dopant and carrier distributions are required to establish the actual relation between the final dopant/carrier distribution and processing steps. This paper provides a review of recent progress in the field of dopant and carrier profile characterization. Factors limiting the final accuracy and depth resolution of SIMS and spreading resistance probe are discussed in combination with recent developments such as the Nanoprofiler and Carrier Illumination which may go to the sub-nm limit. Quantitative 2D-carrier profiling is dominated by scanning probe techniques but is still limited in spatial resolution (/spl sim/10 nm).
Keywords
carrier density; doping profiles; reviews; scanning probe microscopy; secondary ion mass spectroscopy; semiconductor junctions; SIMS; carrier distribution; carrier illumination; carrier profile characterization; depth resolution; dopant distribution; dopant profile characterization; final accuracy; nanoprofiler; quantitative 2D-carrier profiling; scanning probe techniques; spatial resolution; spreading resistance probe; ultrashallow junction profiling; Atomic force microscopy; Instruments; Lighting; Metastasis; Probes; Spatial resolution; Tail; Temperature distribution; Testing; Transmission electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2000. IEDM '00. Technical Digest. International
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-6438-4
Type
conf
DOI
10.1109/IEDM.2000.904348
Filename
904348
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