DocumentCode :
2885923
Title :
Semiconductor Component Technologies and Packaging Structures in Future Switching Systems - Their Impact on Power Systems
Author :
Rundkvist, KieLL
Author_Institution :
Telefonaktiebolaget L M Ericsson, S-126 25 Stockholm, SWEDEN
fYear :
1984
fDate :
4-7 Nov. 1984
Firstpage :
23
Lastpage :
26
Abstract :
For fifteen years the evolution of the telecommunication exchanges has been determined by the development of the semiconductor technology. This paper deals with the use of LSI, VLSI, Gate Arrays, Cell Library and Full Custom Circuits in telecommunication equipment. The use of these circuits will affect packaging structures and the power systems in the future. Network architecture will also be affected by the use of these circuits, but this is mentioned only briefly.
Keywords :
Chip scale packaging; Logic circuits; Logic design; Manufacturing; Power systems; Printed circuits; Semiconductor device manufacture; Semiconductor device packaging; Switching systems; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Telecommunications Energy Conference, 1984. INTELEC '84. International
Conference_Location :
New Orleans, LA, USA
Type :
conf
DOI :
10.1109/INTLEC.1984.4794089
Filename :
4794089
Link To Document :
بازگشت