Technologies for Next Generation T/R Modules

Author

Rosker, Mark J.

Author_Institution

Defense Adv. Res. Projects Agency, Arlington

fYear

2007

fDate

17-20 April 2007

Firstpage

944

Lastpage

947

Abstract

Technologies to enable the next generation of transmit/receive modules for sensor and communications systems are being pursued in programs funded by the Defense Advanced Research Projects Agency (DARPA). DARPA programs contributing to dramatically improved performance and wafer-scale integration for T/R modules will be highlighted. These programs include the Wide Band Gap Semiconductors for RF Applications (WBGS-RF) program, the Scalable Millimeter Wave Architectures for Reconfigurable Transceivers (SMART) program, the Integrated Sensor Is Structure Critical Technology Demonstration (ISIS-CTD), and the Sub-millimeter Wave Imaging Focal-plane Technology (SWIFT) program.

Keywords

millimetre wave receivers; radio transmitters; Defense Advanced Research Projects Agency; Integrated Sensor Is Structure Critical Technology Demonstration program; Scalable Millimeter Wave Architectures for Reconfigurable Transceivers program; Sub-millimeter Wave Imaging Focal-plane Technology program; T/R modules; Wide Band Gap Semiconductors for RF Applications program; communications systems; sensor systems; transmit-receive modules; wafer-scale integration; Bandwidth; Energy consumption; Gallium arsenide; Gallium nitride; High power amplifiers; MMICs; Millimeter wave radar; Millimeter wave technology; Substrates; Wide band gap semiconductors; GaN; MMIC; T/R modules; millimeter wave; power amplifiers;

fLanguage

English

Publisher

ieee

Conference_Titel

Radar Conference, 2007 IEEE

Conference_Location

Boston, MA

ISSN

1097-5659

Print_ISBN

1-4244-0284-0

Electronic_ISBN

1097-5659

Type

conf

DOI

10.1109/RADAR.2007.374346

Filename

4250440