Ceramic Column Grid Array Assembly Qualification and Reliability Analysis for Space Missions

Author

Tripathi, Shivendra ; Patel, Hitesh M. ; Patil, Shrikant A. ; Pandey, Deep Kumar ; Prajapati, Ishwar Lal ; Joshi, Chandresh N. ; Sharma, Rakesh S. ; Arora, Rajkumar

Author_Institution

Space Applic. Centre, Indian Space Res. Organ., Ahmedabad, India

Volume

5

Issue

2

fYear

2015

fDate

Feb. 2015

Firstpage

279

Lastpage

286

Abstract

Ceramic column grid array (CCGA) devices are presently the state-of-the-art packaging solutions for advanced computational electronics. For high-reliability applications incorporating thermal and vibration loads, CCGA columns provide more compliant interconnect during thermal cycle of the assembly and improve interconnection reliability by design. Assembly of such high interconnect count device requires process development and qualification prior to their deployment in space borne payloads. CCGA assembly process development, comprehensive assembly qualification tests (thermal cycling, vibration, humidity, microsectioning, and 3-D Computed Tomography X-ray inspection), and reliability estimation are presented in this paper.

Keywords

assembling; ceramic packaging; interconnections; reliability; space vehicle electronics; CCGA assembly process development; CCGA devices; advanced computational electronics; ceramic column grid array assembly qualification; compliant interconnect; comprehensive assembly qualification tests; high interconnect count device; interconnection reliability; packaging solutions; reliability analysis; reliability estimation; space borne payloads; space missions; thermal cycle; thermal loads; vibration loads; Assembly; Electronic packaging thermal management; Joints; Materials; Reliability; Stress; Vibrations; 3-D-CT X-ray; Ceramic column grid array (CCGA) assembly; ceramic column grid array (CCGA) assembly; coefficient of thermal expansion (CTE); failure rate; microsectioning; qualification; reliability; thermal cycling; thermal cycling.;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2014.2383172

Filename

7015559