DocumentCode :
2886872
Title :
Transient thermal analysis of high-concentration photovoltaic cell module subjected to coupled thermal and power cycling test conditions
Author :
Wang, Ning-Yuan ; Chiang, Shih-Ying ; Chou, Tsung-Lin ; Shih, Zun-Hao ; Hong, Hwen-Fen ; Chiang, Kuo-Ning
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2010
fDate :
2-5 June 2010
Firstpage :
1
Lastpage :
6
Abstract :
Based on the standard of International Electrotechnical Commission (IEC) on the thermal cycling test for a high concentration photovoltaic (HCPV) module, frequent current input must be applied when oven temperature exceeds 25°C. As such, the junction temperature of a solar cell chip would oscillate due to the joule heating effect. However, the fluctuation of the junction temperature might be one of the reliability issues being faced by an HCPV thermal cycling test. The process of getting the actual junction temperature is necessary before its mechanical behavior is discussed. In this study, the forward voltage method was adopted to measure and monitor the time-dependent junction temperature of an HCPV module. In addition, a detailed finite element (FE) model of the HCPV module with adapted input power and suitable boundary condition was established, analyzed, and validated with the experimental data. Results on the finite element analysis (FEA) were consistent with the experimental data. Hence, we conclude that the simulation of the FE model adopted in this research can be effectively used to simulate the transient thermal characteristics of an HCPV module, subjected to coupled power and thermal cycling test conditions.
Keywords :
IEC standards; finite element analysis; photovoltaic cells; reliability; solar cells; thermal analysis; HCPV module; IEC standard; International Electrotechnical Commission standard; finite element analysis; forward voltage method; high-concentration photovoltaic cell module; joule heating effect; junction temperature; mechanical behavior; oven temperature; power cycling test; reliability; solar cell chip; thermal cycling test; transient thermal analysis; Finite element methods; IEC standards; Ovens; Photovoltaic cells; Photovoltaic systems; Solar heating; Solar power generation; Temperature; Testing; Transient analysis; HCPV module; finite element; power cycling test; solar cell; thermal cycling test; transient thermal analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
ISSN :
1087-9870
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2010.5501253
Filename :
5501253
Link To Document :
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