Experimental investigation of hotspot removal using superlattice cooler

Author

Sahu, Ivek ; Joshi, Yogendra K. ; Fedorov, Andrei G.

Author_Institution

George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2010

fDate

2-5 June 2010

Firstpage

1

Lastpage

8

Abstract

Thermal management of high performance microprocessors is becoming increasingly challenging due to the presence of hotspots. Temperature at the hotspot can be substantially greater than rest of the microprocessor, potentially compromising performance and reliability. In this paper, we have presented a hybrid cooling scheme which combines microfluidic and solid-state cooling techniques. Localized hotspot with heat flux close to 250 W/cm² has been successfully removed using this hybrid scheme. The effect of ambient temperature, hotspot size, and superlattice cooler electrode location is also studied.

Keywords

cooling; microprocessor chips; thermal management (packaging); heat flux; high performance microprocessors; hotspot removal; hybrid cooling scheme; localized hotspot; microfluidic cooling; solid-state cooling; superlattice cooler; thermal management; Cooling; Heat sinks; Heat transfer; Microchannel; Microprocessors; Resistance heating; Superlattices; Temperature; Thermal management; Thermoelectricity; Hotspot; microchannel heat sink; solid-state; superlattice coolers; thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1087-9870

Print_ISBN

978-1-4244-5342-9

Electronic_ISBN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2010.5501255

Filename

5501255