Title :
Experimental investigation of hotspot removal using superlattice cooler
Author :
Sahu, Ivek ; Joshi, Yogendra K. ; Fedorov, Andrei G.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Thermal management of high performance microprocessors is becoming increasingly challenging due to the presence of hotspots. Temperature at the hotspot can be substantially greater than rest of the microprocessor, potentially compromising performance and reliability. In this paper, we have presented a hybrid cooling scheme which combines microfluidic and solid-state cooling techniques. Localized hotspot with heat flux close to 250 W/cm2 has been successfully removed using this hybrid scheme. The effect of ambient temperature, hotspot size, and superlattice cooler electrode location is also studied.
Keywords :
cooling; microprocessor chips; thermal management (packaging); heat flux; high performance microprocessors; hotspot removal; hybrid cooling scheme; localized hotspot; microfluidic cooling; solid-state cooling; superlattice cooler; thermal management; Cooling; Heat sinks; Heat transfer; Microchannel; Microprocessors; Resistance heating; Superlattices; Temperature; Thermal management; Thermoelectricity; Hotspot; microchannel heat sink; solid-state; superlattice coolers; thermal management;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2010.5501255
