• DocumentCode
    2886923
  • Title

    Thermal mangament of multicore processors using power multiplexing

  • Author

    Gupta, Man Prakash ; Cho, Minki ; Mukhopadhyay, Saibal ; Kumar, Satish

  • Author_Institution
    Dept. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    One of the novel methods for the thermal management of multi-core processors is power multiplexing (also known as core hopping) which involves dynamical change of the locations of active cores within the chip at fixed time intervals. The power multiplexing technique helps in reducing the number of hotspots on the chip by providing a spatially uniform thermal profile which in turn lowers the maximum temperature rise on the chip. We quantify the effects of power multiplexing on the thermal profile of multi-core processor chip. Different core migration policies have been implemented in an attempt to evolve an optimally suitable policy for the multiplexing purpose. We observe that the selection of appropriate migration policy and the migration rate can efficiently reduce the spatial non-uniformity and peak temperature on the chip. The ratio of active to total cores has been varied to accommodate and analyze the effect of varying computing workload. We correlated the cooling power with the peak temperature on the chip and discussed the efficient usage of core-migration policies in the context of the power reduction.
  • Keywords
    cooling; microprocessor chips; multiplexing; thermal management (packaging); cooling power; core hopping; core-migration policy; migration rate; multicore processor chip; multicore processors; power multiplexing; power reduction; thermal management; thermal profile; Electronic packaging thermal management; Electronics cooling; Energy efficiency; Energy management; Multicore processing; Performance analysis; Temperature; Thermal engineering; Thermal management; Yarn; Core hopping; Hot spots; Multicore; Multiplexing; Timeslice;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501256
  • Filename
    5501256