Title :
Thermal mangament of multicore processors using power multiplexing
Author :
Gupta, Man Prakash ; Cho, Minki ; Mukhopadhyay, Saibal ; Kumar, Satish
Author_Institution :
Dept. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
One of the novel methods for the thermal management of multi-core processors is power multiplexing (also known as core hopping) which involves dynamical change of the locations of active cores within the chip at fixed time intervals. The power multiplexing technique helps in reducing the number of hotspots on the chip by providing a spatially uniform thermal profile which in turn lowers the maximum temperature rise on the chip. We quantify the effects of power multiplexing on the thermal profile of multi-core processor chip. Different core migration policies have been implemented in an attempt to evolve an optimally suitable policy for the multiplexing purpose. We observe that the selection of appropriate migration policy and the migration rate can efficiently reduce the spatial non-uniformity and peak temperature on the chip. The ratio of active to total cores has been varied to accommodate and analyze the effect of varying computing workload. We correlated the cooling power with the peak temperature on the chip and discussed the efficient usage of core-migration policies in the context of the power reduction.
Keywords :
cooling; microprocessor chips; multiplexing; thermal management (packaging); cooling power; core hopping; core-migration policy; migration rate; multicore processor chip; multicore processors; power multiplexing; power reduction; thermal management; thermal profile; Electronic packaging thermal management; Electronics cooling; Energy efficiency; Energy management; Multicore processing; Performance analysis; Temperature; Thermal engineering; Thermal management; Yarn; Core hopping; Hot spots; Multicore; Multiplexing; Timeslice;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2010.5501256