• DocumentCode
    2886960
  • Title

    Development and Use of Small Addressable Arrays for Process Window Monitoring in 65nm Manufacturing

  • Author

    Karthikeyan, Madurakavi ; Gasasira, A. ; Fox, S. ; Yeric, Greg ; Hall, Mathew

  • Author_Institution
    IBM, Hopewell
  • fYear
    2007
  • fDate
    19-22 March 2007
  • Firstpage
    135
  • Lastpage
    139
  • Abstract
    In this paper we report on the development and use of two scribe-line compatible addressable array test structures in 65 nm technology for routine process window monitoring. One array was dedicated for front-end of line test structures, while a second consists exclusively of back-end test structures. Fast testing allows large-scale sampling of wafer lots in a manufacturing environment. Customized software is used to automate data analysis and calculate figures of merit that enable process and equipment performance to be tracked by process module. Examples of successful application of these arrays in identifying and addressing systematic yield detractors are provided.
  • Keywords
    arrays; integrated circuit design; integrated circuit manufacture; integrated circuit technology; integrated circuit testing; integrated circuit yield; large scale integration; process monitoring; automate data analysis; back-end test structures; customized software; figures of merit calculation; front-end test structures; large-scale sampling; process window monitoring; scribe-line compatible addressable array test structures; semiconductor defects; semiconductor device manufacturing environment; size 65 nm; systematic yield detractors; yield optimization; Circuit testing; Manufacturing processes; Microelectronics; Monitoring; Phased arrays; Probes; Read only memory; Semiconductor device manufacture; System testing; USA Councils; Process monitoring; Semiconductor defects; Semiconductor device manufacture; Yield optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 2007. ICMTS '07. IEEE International Conference on
  • Conference_Location
    Tokyo
  • Print_ISBN
    1-4244-0781-8
  • Electronic_ISBN
    1-4244-0781-8
  • Type

    conf

  • DOI
    10.1109/ICMTS.2007.374470
  • Filename
    4252420