DocumentCode :
2887274
Title :
Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics
Author :
Lall, Pradeep ; Shantaram, Sandeep ; Panchagade, Dhananjay
Author_Institution :
Dept. of Mech. Eng., Auburn Univ., Auburn, AL, USA
fYear :
2010
fDate :
2-5 June 2010
Firstpage :
1
Lastpage :
12
Abstract :
Electronic packages subjected to drop and shock have been simulated using alternative theory known as peridynamic theory in the realm of FEM. In peridynamics, problems are formulated in terms of integral equation which is a substitute to conventional solid mechanics theory where problems are formulated in terms of partial differential equations. This alternative approach is more potent than conventional finite-element method because the integral equations remain valid even at discontinuities which enables to model crack initiation and crack propagation which can occur at multiple locations simultaneously. Previously, Agwai [2008] has demonstrated the use of peridynamic models using EMU code. In this paper, a peridynamic-theory based drop and shock model has been developed via finite element code using truss elements [Macek 2007]. The method enables the implementation of peridynamic theory in a commercial finite-element platform. Model predictions of peridynamic-models have been validated with experimentation for leadfree solder alloys system.
Keywords :
electronics packaging; finite element analysis; integral equations; partial differential equations; solders; vibrations; EMU code; FEM; crack initiation modelling; crack propagation modelling; electronic packaging; finite element code; finite element modelling; integral equation; integral equations; lead free electronics; leadfree solder alloys system; partial differential equations; peridynamic models; shock reliability; solid mechanics theory; truss elements; vibration reliability; Circuit testing; Electric shock; Electronics packaging; Finite element methods; Integral equations; Lead; Partial differential equations; Predictive models; Solids; Vibrations; Drop; Electronic package; Explicit Finite-Elements; Impact; Peridynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
ISSN :
1087-9870
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2010.5501274
Filename :
5501274
Link To Document :
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