Title :
Dynamic Analyses of Membranes and Thin Films on Wafer Level
Author :
Gerbach, R. ; Naumann, F. ; Ebert, M. ; Bagdahn, J. ; Klattenhoff, J. ; Rembe, C.
Author_Institution :
Fraunhofer Inst. for Mech. of Mater., Halle
Abstract :
In this paper a method is described that can be applied for the non-destructive characterisation of micromechanical structures. This method can be used to inspect membranes and thin films on wafer level and is based on a combination of dynamic measurements via a laser-Doppler-vibrometer in combination with numerical simulations. First investigations are done on silicon membrane structures at production related conditions to determine the thickness of membrane. An outlook is given to apply this method for the determination of residual stresses in thin films at wafer level e.g. to characterise coating processes.
Keywords :
Doppler measurement; internal stresses; measurement by laser beam; membranes; micromechanical devices; nondestructive testing; process monitoring; silicon; thin film devices; vibration measurement; Si; dynamic analysis; laser-Doppler-vibrometer; micromechanical structures; nondestructive characterisation; optical control; process monitoring; residual stresses; silicon membrane structures; stress measurement; wafer level thin films; Biomembranes; Etching; Manufacturing processes; Micromechanical devices; Numerical simulation; Optical materials; Residual stresses; Silicon; Testing; Transistors; numerical simulation; optical control; process monitoring; stress measurement;
Conference_Titel :
Microelectronic Test Structures, 2007. ICMTS '07. IEEE International Conference on
Conference_Location :
Tokyo
Print_ISBN :
1-4244-0781-8
Electronic_ISBN :
1-4244-0781-8
DOI :
10.1109/ICMTS.2007.374486
