Interfacial failure simulation of single solder joint using a multiscale approach

The interface damage of single solder joint was simulated using cohesive zone model incorporated in finite element analysis. In this study, the solder/IMC/Cu pad interfaces models were constructed for the molecular dynamics simulation. The traction-separation law was derived when the interface model was subjected to a principle strain in one direction. The materials properties of cohesive element for finite element analysis (FEA) were then extracted from the molecular dynamics (MD) calculations. The multiscale simulation results show that the interface damage can be captured well based on the cohesive zone model coupling with MD simulation results, particular when the brittle failure is the dominant mode at the interfaces of single solder joint.