Title :
Mechanical challenge of frameless PV-modules
Author :
Weller, Bernhard ; Tautenhahn, Lutz
Author_Institution :
Inst. of Building Constr., Tech. Univ. Dresden, Dresden, Germany
Abstract :
Frameless glass-to-glass PV-modules are exposed to a wide range of weather conditions, depending on their destined place of installation. Numerous aspects affect the mechanical stability as well as the mechanical durability under static and dynamic load conditions. These aspects are presented and discussed in detail. Existing test procedures are described and assessed with regard to their ability to embrace all influencing parameters. The structure of a glass-to-glass PV-module shares many similar features with laminated glazing elements used in building facades, which allows adopting knowledge from the structural use of glass in buildings. However, in some aspects, typical PV-modules show characteristic features, which significantly differ from standard laminated glass. This highlights the need for further studies in this field. The Institute of Building Construction uses numerical simulation to investigate different influencing aspects. Material properties are obtained at the Institutes laboratory. The experience of using glass in buildings and the specific needs of the industry provide a fundamental basis for the development of innovative support and reinforcing systems for building-integrated PV-Modules. The Institute´s state-of-the-art testing facilities provide the opportunity to apply static and dynamic loads on PV-systems and measure the system response. The research activities also cover dynamic studies to assess the durability of PV-modules.
Keywords :
construction industry; durability; glass; laminates; mechanical stability; mechanical testing; numerical analysis; building facades; building-integrated PV-modules; dynamic load condition; frameless PV-modules; frameless glass-to-glass PV-modules; laminated glass; laminated glazing elements; material properties; mechanical durability; mechanical stability; numerical simulation; reinforcing systems; static load condition; test procedures; Buildings; Clamps; Glass; IEC standards; Laminates; Production; Stability; Stress; Testing; Transistors; FE-method; durability; dynamic testing; experimental data; stability;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2010.5501292