Title :
Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint
Author :
Kariya, Yoshiharu ; Sat, Kana ; Asari, Shota ; Kanda, Yoshihiko
Author_Institution :
Mater. Sci. & Eng. Dept., Shibaura Inst. of Technol., Tokyo, Japan
Abstract :
The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150μm. The reduction in life is due to that the crack propagation stage does not appear and complete failure occurs simultaneously with the crack initiation in the ball size less than 150μm. The failure in the smallest size is induced by formation of subgrain boundary formation that occurs in whole area of the joint.
Keywords :
cracks; fatigue; solders; Sn-Ag-Cu solder joint; ball size; crack initiation life; crack propagation; joint size; low cycle fatigue characteristics; low-cycle fatigue properties; micro solder balls; Copper alloys; Crystal microstructure; Educational institutions; Fatigue; Materials science and technology; Semiconductor device packaging; Semiconductor device reliability; Soldering; Testing; Thermal stresses; Fracture; Lead-free solder; Low-cycle fatigue; Microstructure; Miniature testing; Sn-Ag-Cu;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2010.5501298
