DocumentCode
2887916
Title
Extracting nanowire mechanical properties from three-point bendig test
Author
Liu, Yun ; Zhang, Yin
Author_Institution
Fac. of Inf. & Autom., Kunming Univ. of Sci. & Technol., Kunming, China
fYear
2010
fDate
2-5 June 2010
Firstpage
1
Lastpage
6
Abstract
A new adhesive receding contact model is presented in this paper for the nanowire in three-point bending test. Because of its flexurality, the nanowire in test may lift-off/separate from its supporting elastic medium, which can dramatically change the nanowire boundary conditions and deformations. The changes of the nanowire boundary conditions and deformations have the significant impact on the interpretation of the experimental data on the nanowire material properties. Through the model developed here, some explanations are offered to the different even contradicting observations on the nanowire material properties and the nanowire boundary conditions changing trends found in recent experiments.
Keywords
adhesives; bending; deformation; electrical contacts; materials properties; nanowires; Young´s modulus; adhesive receding contact model; deformations; nanowire boundary conditions; nanowire material property; nanowire mechanical property extraction; three-point bendig test; Atomic force microscopy; Boundary conditions; Data mining; Gold; Material properties; Materials testing; Mechanical factors; Nanomaterials; Nanostructured materials; Spatial resolution; Young´s modulus; adhesion; boundary conditions; lift-off; nanowire; receding contact;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1087-9870
Print_ISBN
978-1-4244-5342-9
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2010.5501304
Filename
5501304
Link To Document