• DocumentCode
    2887916
  • Title

    Extracting nanowire mechanical properties from three-point bendig test

  • Author

    Liu, Yun ; Zhang, Yin

  • Author_Institution
    Fac. of Inf. & Autom., Kunming Univ. of Sci. & Technol., Kunming, China
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A new adhesive receding contact model is presented in this paper for the nanowire in three-point bending test. Because of its flexurality, the nanowire in test may lift-off/separate from its supporting elastic medium, which can dramatically change the nanowire boundary conditions and deformations. The changes of the nanowire boundary conditions and deformations have the significant impact on the interpretation of the experimental data on the nanowire material properties. Through the model developed here, some explanations are offered to the different even contradicting observations on the nanowire material properties and the nanowire boundary conditions changing trends found in recent experiments.
  • Keywords
    adhesives; bending; deformation; electrical contacts; materials properties; nanowires; Young´s modulus; adhesive receding contact model; deformations; nanowire boundary conditions; nanowire material property; nanowire mechanical property extraction; three-point bendig test; Atomic force microscopy; Boundary conditions; Data mining; Gold; Material properties; Materials testing; Mechanical factors; Nanomaterials; Nanostructured materials; Spatial resolution; Young´s modulus; adhesion; boundary conditions; lift-off; nanowire; receding contact;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501304
  • Filename
    5501304