On VLSI interconnects

Author

Wing, Omar

Author_Institution

Dept. of Electr. Eng., Columbia Univ., New York, NY, USA

fYear

1991

fDate

16-17 Jun 1991

Firstpage

991

Abstract

The author reviews some recent approaches to the computation of transient response of VLSI circuits interconnected by transmission lines and discontinuities such as angled-bends. These approaches are based on modeling of the interconnects as subcircuits consisting of ordinary lumped elements, controlled sources and sections of ideal transmission lines (delay elements). In this way, the transient solution of the entire circuit can be obtained from a SPICE-like simulator, and FFT, discrete convolution or inversion of the Laplace transform can all be avoided. Examples of models of lossy transmission lines and 90° bends are given

Keywords

VLSI; circuit analysis computing; semiconductor device models; time-domain analysis; transient response; transmission line theory; RLGC line; SPICE-like simulator; VLSI interconnects; angled-bends; controlled sources; delay elements; discontinuities; lumped elements; modeling; subcircuits; transient response; transmission lines; Circuit simulation; Convolution; Delay lines; Distributed parameter circuits; Integrated circuit interconnections; Laplace equations; Power system transients; Transient response; Transmission line discontinuities; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 1991. Conference Proceedings, China., 1991 International Conference on

Conference_Location

Shenzhen

Type

conf

DOI

10.1109/CICCAS.1991.184532

Filename

184532