• DocumentCode
    2888368
  • Title

    An investigation into the solidification of nano-enhanced phase change material for transient thermal management of electronics

  • Author

    Sanusi, Omar ; Fleischer, Amy ; Weinstein, Randy

  • Author_Institution
    Dept. Mech. Eng., Villanova Univ., Villanova, PA, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Cyclically utilized electronics provide an interesting challenge for thermal management. Phase Change Materials (PCM) are ideal for cyclic operations due to their high capacity to store heat, however, many phase change materials do not exhibit sufficient conductivity to be effective in larger sizes. Conductivity enhancement can be done in a number of ways including the use of foams or nanomaterials. This experimental study examines the thermal behavior of PCMS with carbon nanofibers conductivity enhancement during solidification. The enhanced PCM is found to exhibit lengthened melt times and shortened cool-down times.
  • Keywords
    carbon fibres; graphite; nanofibres; phase change materials; solidification; thermal conductivity; C; PCM; carbon nanofibers; conductivity; cool-down times; electronics; melt times; nano-enhanced phase change material; solidification; thermal behavior; transient thermal management; Conducting materials; Electronics cooling; Nanomaterials; Nanostructured materials; Phase change materials; Power system transients; Thermal conductivity; Thermal management; Thermal management of electronics; Thermal resistance; CNT; PCM; carbon fibers; electronics cooling; energy storage; graphite nanofibers; melting; nanomaterials; paraffin wax; phase change material; solidification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501328
  • Filename
    5501328